Manufacturing capacity

Manufacturing capability

Precision manufacturing, industry benchmark

We operate a modern electroplating production base that is scalable, automated, and information-driven, equipped with industry-leading machinery and a stringent quality management system. We are committed to providing a stable supply of zero-defect, highly consistent precision components for fields such as mobile phones, consumer electronics, and automotive electronics.

Scaled and Automated Production Lines

The 38 routes operated by our companySemi-automatic continuous electroplating production line, 2 linesAutomated continuous electroplating production line, as well as a barrel plating line added to meet the needs of target customers.It can achieve 24-hour uninterrupted and stable operation. Production line integration.Material buffering machine for loading/unloading, on-line/off-line CCD, laser gold-stripping machine, intelligent handling cartMoreover, we aim to minimize human intervention as much as possible, ensuring process stability and product consistency to meet the demands of large-volume customer orders. As times advance and the industry evolves, our company plans in the future to fully upgrade our remaining semi-automatic production lines into fully automated ones, thereby satisfying the ever-growing demand for quality.

Material receiving buffer
Online CCD Inspection
Laser gold removal machine

Highly targeted

Mobile phone PCB components

Adopting high precisionContinuous electroplating lineAchieve efficient and uniform plating coverage for micro and mini connectors, shielding housings, and similar components.

Automotive central control screen components

Having a dedicatedHigh-speed barrel plating lineSuitable for various connectors and small hardware components, with enormous production capacity.

Consumer electronics components

Equipped withPulse plating power supplyThe intelligent production line provides precise control for high-demand functional coatings.

Core Processes and Special Manufacturing Techniques

Dedicated to driving development through innovative, environmentally friendly electroplating.

Micro-pore deep plating capability

Specifically for HDI boards on mobile phonesMicrovia and blind viaR&D, leveraging advanced chemical plating systems and power supply technology, ensures deep plating capability within the holes and guarantees complete and reliable signal transmission.

Micro-pore deep plating capability

Selective plating

Can be implemented for automotive connectorsLocal gold plating, silver platingWhile ensuring performance in critical areas, we significantly optimize costs for our customers.

RF board-end housing

Composite Coating Technology

Maturely masterNickel-Palladium-Gold, Nickel-Gold-PlatedThe multi-layer plating process meets the ultra-high requirements for wire bonding, soldering, and oxidation resistance in consumer electronics chip packaging and high-frequency connectors.

Composite Coating Technology

Core process BTB

The terminal function area shows no solder bridging; the soldering condition of the leads indicates good soldering.

Eco-friendly green process